Materialographic Preparation and Evaluation of Microelectronic Devices

Please join us as we discuss Struers’ solutions for preparing microelectronic devices.

Microelectronic components present a unique challenge for materialographic preparation. In microelectronic components, various materials with widely differing properties are packaged together (glass, ceramics, metals, and polymers), so preparing all materials well can be difficult. Additional complications arise from the small size, complex geometry, and need for controlled material removal to reach a plane of interest.

In this webinar attendees will learn about:

• Challenging clamping of complex and small samples
• Vacuum impregnation to fill vias with epoxy resin
• Controlled material removal to reach a plane of interest
• Excellent scratch-free preparation of materials with varying properties